SK hynix eyes Intel EMIB-T for next-generation HBM

SK hynix is reportedly becoming a customer for Intel Foundry’s EMIB advanced packaging, marking a notable win for Intel’s packaging business. During Hot Chips 2026, SK hynix said it is collaborating with TSMC to integrate HBM memory into CoWoS-L, CoWoS-S, CoWoS-R and Intel EMIB.

The company described HBM development moving from approximately 1,024 pins to 2,048 pins in the latest HBM4, with TSV counts increasing as designs become more complex. SK hynix said next-generation memory for advanced AI accelerators will require 2.5D packaging, hybrid bonding and 3D DRAM integration.

Intel’s EMIB-T is positioned as a potential option for customers looking to diversify beyond TSMC’s CoWoS. The variant includes TSVs that enable vertical power delivery across multiple stacked chips, aligning with SK hynix’s package-level concept for vertical power delivery in 3D memory modules.