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SK hynix

The latest AI news tracked under SK hynix.

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This week

SK hynix shifts more DRAM output to 1c node

SK hynix is moving a growing share of memory production to its latest 1c DRAM process…

2 weeks ago

Chips

SK hynix weighs Intel Foundry for HBM4E base dies

SK hynix is reportedly considering Intel Foundry alongside TSMC for HBM4E base die production. The move…

3 weeks ago

Chips

SK hynix sees memory shortage lasting through 2030

CEO Kwak Noh-Jung said the memory market has not shown clear signs of slowing, with AI…

3 weeks ago

Chips

U.S. presses South Korean chipmakers on domestic memory fabs

Washington is reportedly seeking new South Korean investment in American DRAM production as supply chain pressure…

4 weeks ago

Chips

SK hynix eyes Intel EMIB-T for next-generation HBM

SK hynix is reportedly moving toward Intel Foundry’s EMIB advanced packaging as part of its next-generation…

4 weeks ago

Chips

SK hynix plans NAND output expansion in China

Solidigm is preparing to restart growth at its Dalian fab after a long pause tied to…

1 month ago

All SK hynix news

9 SepChipsSK hynix shifts more DRAM output to 1c node

2 SepChipsSK hynix weighs Intel Foundry for HBM4E base dies

1 SepChipsSK hynix sees memory shortage lasting through 2030

27 AugChipsSK hynix eyes Intel EMIB-T for next-generation HBM

27 AugChipsU.S. presses South Korean chipmakers on domestic memory fabs

14 AugChipsSK hynix plans NAND output expansion in China

9 AugInfrastructureSK hynix plans new memory fabs in Yongin and Cheongju

2 AugChipsOmdia lifts 2026 chip outlook as AI strains supply

29 JulBusinessSK hynix posts record 2Q26 results on AI server demand

25 JulChipsNAND Flash shortages may ease in 2027

22 JulChipsSK hynix weighs US fab as Chey warns on chipflation

20 JunChipsSK hynix ships HBM4E samples to major customers

26 MayChipsSK hynix launches iHBM thermal solution for next-generation HBM

12 MayChipsSK hynix explores Intel EMIB for HBM packaging

21 AprChipsSK hynix starts mass production of 192 GB SOCAMM2

16 AprChipsASML raises EUV shipment target as memory demand grows

16 AprChipsTesla completes AI5 chip design with TSMC and Samsung

30 MarChipsHBM4 validation on track for 2Q26 as three suppliers target NVIDIA Rubin

30 MarChipsSK hynix and Samsung ready faster LPDDR6 memory for ISSCC 2026

30 MarBusinessSK hynix plans United States unit for AI datacenter solutions

30 MarChipsMLC NAND flash faces sharp capacity drop as major suppliers exit

30 MarChipsSK Hynix slows HBM4 ramp as HBM3E demand persists

30 MarChipsSK hynix showcases advanced AI memory from HBM4 to next-gen storage at SC25

30 MarChipsSK hynix prepares 7200 mt/s ddr5 chips with new 2 gb b-die and 4 gb m-die