Kioxia and Sandisk unveil denser QLC 3D flash

Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A), and Sandisk Corporation (Nasdaq: SNDK) unveiled next-generation QLC 3D flash memory technology focused on higher density, performance and power efficiency. The companies say the design delivers up to 60% increase in bit density compared to their 8th-generation technology, surpassing 37 Gb/mm².

The new memory uses CMOS directly Bonded to Array, or CBA, a process that fabricates CMOS logic and the memory array on separate wafers before bonding them with high-precision wafer-to-wafer alignment. Kioxia and Sandisk say the approach improves read and write bandwidth over 8th-generation 3D flash memory and makes it the industry’s first QLC 3D flash memory technology to reach a 4.8 Gb/s interface.