CoWoS-L expected to lead AI chip packaging through 2028

GPU suppliers and hyperscale CSPs are developing more powerful and versatile AI chips, pushing larger package sizes higher on the roadmap for 2.5D packaging. TrendForce expects TSMC’s CoWoS-L to remain the mainstream advanced packaging solution for AI chips through 2028, despite competitive pressure from Intel’s EMIB-T.

CoWoS-L’s position is supported by advantages in technology maturity and yield. Strong AI demand is also backing NVIDIA’s move toward integrated GB/VR rack-scale solutions that combine large numbers of chips, with NVIDIA’s high-end GPU shipments expected to grow approximately 30% YoY in 2026.

AMD is adding further momentum to the market by promoting its MI400/MI450 series beginning in the second half of 2026. The combined activity from major GPU vendors points to continued demand for advanced packaging capacity as AI systems scale in complexity and chip count.