TSMC reaches 20,000 wafers per month on 2 nm node

TSMC has reportedly reached 20,000 wafers per month on its N2 process, marking a new scaling milestone for 2 nm high-volume manufacturing. The company is manufacturing the node across five fabs in Taiwan, but only one fab is currently in volume production on N2. That site is reportedly Fab 20, which has reached the reported output level.

High-volume production for N2 began in the fourth quarter of 2025. Following that start, 2 nm represents only 3% of TSMC’s revenue, compared with 30% for 3 nm and 33% for 5 nm, which remains the company’s largest revenue contributor among the cited nodes.

Demand appears to be building. TSMC recently confirmed that N2 has four times the number of tape-outs compared with its prior leading-edge 3 nm N3 node. The GAAFET-based process is said to deliver up to a 15% performance increase at the same power level or up to a 30% power reduction at the same speed, with customers including AMD for EPYC ‘Venice’ server CPUs and Apple for A20 Pro chips in the iPhone 18 Pro series.