Midea shows cooling stack for AI data centers in Singapore

Midea Building Technologies showcased its next-generation power-cooling hyperconvergence architecture and full-stack AI Data Center cooling solutions at Data Center World Asia 2026 in Singapore. The portfolio targets high-density computing, liquid cooling, tropical climates and low-carbon operation across the Asia-Pacific region.

The company presented what it called the industry’s first power-cooling hyperconverged architecture, combining power systems, energy storage, magnetic bearing cooling sources and liquid cooling CDUs into a unified infrastructure stack. The approach is designed to align power supply and cooling earlier in data center planning, construction and operation, while reducing reliance on mechanical cooling through coordinated use of magnetic bearing cooling, free cooling and liquid cooling terminals.

Midea also highlighted three products for full-chain heat dissipation. Its Magnetic CDU reduces equipment footprint by up to 70% and supports a PUE below 1.2 under suitable operating conditions. An air-cooled magnetic centrifugal chiller is designed for hot, water-scarce environments and delivers a COP of up to 5.4, while an industrial-grade CDU provides 2.6 MW cooling capacity at a 3K temperature difference for large AI clusters and high-density racks.

The company also promoted its collaboration with Keppel on green data center infrastructure. The Gui’an Midea Cloud Data Center in China combines Midea hardware with Keppel’s digital platform to deliver up to 7,654 hours of annual free cooling and a stable PUE below 1.2.