TSMC and ASML push larger photomasks for High NA EUV

ASML Holding N.V. and Taiwan Semiconductor Manufacturing Company announced a collaborative initiative aimed at leading the semiconductor industry’s shift to a larger-format Extreme Ultraviolet lithography photomask for High NA EUV manufacturing.

High NA EUV production will initially use current 6-inch masks, while a transition to larger 12-inch masks is expected to improve fab productivity, reduce chipmaking costs and eliminate stitching constraints. The companies said the change would help advanced chip manufacturers better use High NA EUV and make future generations of leading-edge chips more cost-effective.