GlobalFoundries lines up CHIPS Act support for silicon photonics

GlobalFoundries has signed a letter of intent with the U.S. Department of Commerce to advance next-generation silicon photonics technologies under the administration of Donald J. Trump. The United States Government will acquire approximately a 1% equity stake in the company as part of the arrangement, which centers on expanding domestic capabilities for technologies increasingly important to AI infrastructure.

The company said the funding will support next-generation silicon photonics and advanced packaging work, including near-packaged optics, co-packaged optics, 3D hybrid bonding, and novel material development. GlobalFoundries plans to invest the R&D funds in manufacturing facilities in Malta, New York, and Burlington, Vermont, as part of its commitment to build manufacturing capacity on U.S. soil.

GlobalFoundries has shifted its strategy toward specialized technologies after ending leading-edge node research, development, and manufacturing as the industry moved to 7 nm. Its recently introduced SCALE platform, short for Silicon Photonics Co-Packaged Advanced Light Engine, supports 400 Gb/s package transfers with high energy efficiency.