Samsung and AMD expand collaboration on next-generation AI memory

Samsung Electronics has signed a Memorandum of Understanding with AMD to expand their strategic collaboration on next-generation Artificial Intelligence memory and computing technologies. The agreement was formalized at Samsung’s chip manufacturing complex in Pyeongtaek, Korea, with AMD Chair and CEO Dr. Lisa Su and Samsung Electronics Vice Chairman and CEO Young Hyun Jun attending the signing ceremony.

The expanded partnership centers on technologies tied to advancing Artificial Intelligence computing. Samsung highlighted collaboration spanning HBM4, next-generation memory architectures, foundry services, and advanced packaging, positioning the agreement as a broader effort to support AMD’s evolving Artificial Intelligence roadmap.

Young Hyun Jun said Samsung and AMD share a commitment to advancing Artificial Intelligence computing and described the agreement as reflecting the growing scope of the relationship. He said Samsung’s capabilities across memory, foundry, and packaging create a turnkey offering intended to support AMD’s next generation of Artificial Intelligence systems.