MediaTek CEO Announces Q4 2025 Tape-out for First 2 nm Chip

During his keynote at Computex 2025, Dr. Rick Tsai, CEO of MediaTek, unveiled ambitious plans for the company´s next leap in semiconductor technology. The company, which currently produces its top-tier chipsets at TSMC using 3 nm processes, is set to move into 2 nm production. According to Dr. Tsai, a tape-out phase for the first 2 nm design is anticipated by September 2025, marking an important milestone for the fabless chip designer.

Insider information suggests that the forthcoming Dimensity 9500 mobile chipset will leverage TSMC´s ´N3P´ 3 nm process, but the clear focus of the keynote was on what comes next. MediaTek is reportedly poised to benefit from TSMC´s latest 2 nm (N2) mass production capabilities. Industry expectations center on a flagship chipset—potentially called the Dimensity 9600—built on the new 2 nm node, with commercial product launches projected for late 2026.

This strategic transition is more than just a process shrink. MediaTek´s migration from 3 nm to 2 nm is expected to bring significant gains in both performance and energy efficiency. Projections suggest a performance increase of approximately 15% and a reduction in power consumption of around 25%. These improvements could facilitate more powerful mobile devices and advanced features, including those integral to Artificial Intelligence and edge computing, strengthening MediaTek´s competitiveness against rivals in the high-end chipset market.