Kepler Computing exits stealth with FeRAM-based HBM alternative

Kepler Computing has emerged from seven years in stealth with a custom memory technology aimed at easing pressure around HBM supply. The startup claims its approach combines a new 3D stacking technique with novel materials and ferroelectric RAM, or FeRAM, to preserve standard HBM capacity while significantly cutting manufacturing costs.

The company says it reached a scalable design after 35 iterations of composites and plans to use mature semiconductor nodes rather than cutting-edge processes that typically require EUV lithography. In early work with GlobalFoundries, Kepler converted a standard 28 nm manufacturing facility into a memory fab in just eight months, compared with a typical 24-month lead time for traditional DRAM.

Kepler has processed about 2,000 wafers of the new DRAM technology and expects its first HBM samples later this year. Full-scale production runs are planned at GlobalFoundries’ Singapore facility next year, with manufacturing in the United States slated to begin in 2028.