Intel Nova Lake die shots reveal mobile chip layouts

Die shots shared by the Moore’s Law Is Dead YouTube channel reveal the reported layouts of Intel’s upcoming Nova Lake-HX and Nova Lake-H mobile processors. Nova Lake-HX features an 8+16+4 core configuration, comprising 8 P-Cores, 16 E-Cores, and 4 LPE-Cores. Its package measures 12×30 mm, amounting to 360 mm², with functional and passive dies manufactured using different process nodes.

The HX graphics tile uses Intel 3-E, contains 4 Xe GPU cores and covers roughly 26 mm². A central hub built on Intel 18A-P houses the low-power cores and occupies 72 mm², while a peripheral control tile measures 58 mm². The main compute tile uses TSMC N2P, hosts the 8P+16E CPU core configuration and occupies 104 mm². Dummy and passive tiles provide structural support for the package.

The smaller Nova Lake-H features a 4+8+4 configuration with 4 P-Cores, 8 E-Cores, and 4 LPE-Cores. Its package measures 12×23 mm, with a total die area of 276 mm². The TSMC N2P compute tile shrinks to 55 mm², and the adjacent passive die occupies 45 mm². The graphics, central hub and peripheral control tiles remain unchanged from the HX variant.