Cadence introduces LPDDR5X memory IP system for data centers
Cadence has announced an LPDDR5X 9600 Mbps memory IP system solution for enterprise and data center…
3 months ago
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Cadence unveils cache-coherent HiFi 5s SMP to address advanced audio processing demands
Cadence introduces its HiFi 5s SMP, aiming to simplify high-performance, multicore audio processing for generative AI…
3 months ago
Cadence and Samsung Foundry deepen partnership to speed SoC and chiplet design for AI and automotive sectors
Cadence expands its collaboration with Samsung Foundry, aiming to accelerate advanced SoC, 3D-IC, and chiplet solutions…
3 months ago
Cadence debuts agentic AI tool for chip design and verification
Cadence has introduced the ChipStack AI Super Agent, an agentic AI design tool positioned to streamline…
4 months ago
Cadence unveils sixth generation Tensilica Hi-fi iQ DSP for voice AI and immersive audio
Cadence has introduced the Tensilica Hi-fi iQ DSP IP, a new sixth generation architecture aimed at…
5 months ago
Cadence builds chiplet partner ecosystem for physical AI and data center designs
Cadence has introduced a Chiplet Spec-to-Packaged Parts ecosystem aimed at simplifying chiplet design for physical AI,…
6 months ago
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