YMTC prepares for faster LPDDR5X mass production

YMTC is reportedly preparing to begin volume production of LPDDR5X memory at 9,600 MT/s, expanding beyond its core NAND Flash business. The planned production at Fab 3 will use Vertical Channel Transistor (VCT) 4F² cell structure technology. According to Counterpoint Research, YMTC has already been producing about 5,000 wafers per month of 16 Gb LPDDR5X DRAM running at 7,500 MT/s at Fab 2 since October 2025.

YMTC also has capabilities in 3D silicon through its Xtacking 4.0 technology, which allows memory cell wafers to be manufactured separately from peripheral logic circuits and then combined through hybrid bonding wafer-to-wafer stacking. The process creates a permanent connection between silicon chips by fusing embedded metal bumps into a single chip. This approach can connect multiple dies or entire silicon wafers by stacking the back ends of chips together.