GlobalFoundries to operate two new fabs in New York

GlobalFoundries has been selected to provide technology and operate two planned semiconductor fabs at its Malta, New York, site under a U.S.-Japan initiative. The project is not a direct investment by the company. Groundbreaking for the first 300 mm fab is expected later this year, with production scheduled to begin in 2029. Another fab is planned for a later phase. Each facility is expected to produce around 900,000 wafers annually when fully operational. GlobalFoundries expects baseline capacity around 2031-2032 for the first fab and projects 2033 for the second.

The expansion accompanies efforts to develop advanced packaging and semiconductor manufacturing capabilities. AMD announced in April that it plans to work with GlobalFoundries on co-packaged optics for its next-generation Instinct MI500 AI accelerators, scheduled for 2027. GlobalFoundries is also preparing to begin mass production of its 7 nm-class FDX Fusion technology at its Dresden, Germany, facility in 2028.

Separately, GlobalFoundries has agreed with the U.S. Department of Commerce to amend its CHIPS and Science Act award, redirecting funding to accelerate silicon photonics, silicon-germanium and advanced packaging investments in Malta and Burlington, Vermont. Under a separate agreement, the U.S. government will receive an approximately 4% equity stake.