NVIDIA and TSMC apply AI to chip design and manufacturing

NVIDIA announced that TSMC is using NVIDIA accelerated computing and Artificial Intelligence to advance semiconductor design and manufacturing. The collaboration focuses on bringing Artificial Intelligence into fabs as semiconductor development moves toward more advanced nodes and the path from design to high-volume production becomes increasingly complex.

Computational lithography, transistor simulation, process control and wafer inspection now require massive-scale simulation and real-time optimization, along with Artificial Intelligence systems that can provide support across physics, images and other applications. These workloads are turning semiconductor development and production into one of the world’s most complex computing challenges.

TSMC is applying NVIDIA technologies across the semiconductor design and manufacturing lifecycle. The goal is to improve turnaround time, energy efficiency, yield and operational productivity in advanced fabs by using accelerated computing and Artificial Intelligence throughout critical stages of chip design and production.