NVIDIA may use Intel Foveros packaging in 2028

NVIDIA may utilize Intel’s Foveros packaging technology for AI chips in the second half of 2028. Foveros offers vertical 3D stacking, a chip packaging approach that could support future product designs.

The potential move is aimed at diversifying NVIDIA’s supply chain by alleviating capacity constraints. No further details were provided on specific chips, production volumes, or commercial terms.