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Saturday 7 November 2026
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TSMC
The latest AI news tracked under TSMC.
193
Articles
1
This week
All TSMC news
21 Jan
Chips
Tesla completes AI 5 chip and revives Dojo 3 with Intel packaging deal
20 Jan
Chips
TSMC struggles to meet surging AI chip demand as rivals reposition
17 Jan
Chips
Samsung foundry hits 50% yields on 2 nm GAA node amid push for SF2P
16 Jan
Models
TSMC to boost capital spending as demand for AI chips surges
13 Jan
Chips
HPC News Bytes highlights major chip reveals at CES and neuromorphic breakthrough
2 Jan
Chips
TSMC begins 2 nm mass production at new fab in southern Taiwan
31 Dec
Chips
The chip industry in 2025: Boom, rivalry, and a fragile new order
26 Dec
Chips
Intel Fab 52 outscales TSMC Arizona in advanced wafer production
24 Dec
Chips
Cadence tapes out 64 Gbps UCIe chiplet interconnect on TSMC N3P
19 Dec
Chips
Rapidus develops glass panel-level packaging for high-performance AI chips
18 Dec
Chips
How China built a semiconductor push to rival western AI leadership
18 Dec
Chips
Rivian debuts custom AI chip to power autonomy platform
15 Dec
Chips
Intel pushes foundry reboot, AI accelerators, and strategic deals amid government stake and Nvidia tie up
15 Dec
Chips
Semiconductors and AI chips weekly briefing for December 12, 2025
13 Dec
Chips
TSMC may shift Japan phase 2 fab to N4 and N5 as demand changes
10 Dec
Chips
TSMC’s advanced packaging reportedly at max capacity as AI demand grows
4 Dec
Chips
AWS releases Trainium3 ASIC for AI workloads
3 Dec
Chips
NVIDIA reportedly sole TSMC A16 node customer
2 Dec
Chips
TSMC showcases custom C-HBM4E as N3P logic dies target double efficiency
2 Dec
Chips
Rewriting Intel’s story: AI-driven capacity constraints turn it into a strategic alternative to TSMC
30 Nov
Chips
AI’s long-term infrastructure play: the semiconductor and cloud compute revolution
27 Nov
Chips
TSMC reiterates node leadership as AI workloads drive N2 to A14
27 Nov
Chips
AI boom drives demand for ultra-large packaging as ASICs expected to shift from CoWoS to EMIB
25 Nov
Chips
AMD confirms Zen 6 (2 nm) and Zen 7 with efficiency and AI upgrades
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