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Micron
The latest AI news tracked under Micron.
49
Articles
1
This week
All Micron news
4 Mar
Chips
Micron unveils 256 GB low power server memory module for AI data centers
15 Feb
Infrastructure
Micron 9650 PCIe Gen 6 data center SSD enters mass production
9 Feb
Chips
Micron’s memory chips position it as a quiet AI powerhouse
8 Feb
Chips
Nvidia selects SK hynix and Samsung HBM4 for Vera Rubin, shifts Micron to LPDDR5X
9 Jan
Chips
Micron to break ground on New York megafab for AI era memory
21 Dec
Chips
Tech industry grapples with AI growth, regulation, and infrastructure costs
6 Dec
Business
Dell raises pc prices 15-20% as memory costs surge; Lenovo follows
4 Dec
Business
Micron to exit Crucial consumer business, ending retail SSD and DRAM sales
2 Dec
Chips
Micron reportedly drafting new $9.6 billion HBM plant in Hiroshima
2 Dec
Chips
TSMC showcases custom C-HBM4E as N3P logic dies target double efficiency
25 Nov
Chips
CXMT unveils homegrown DDR5-8000 and LPDDR5X-10667 memory
30 Oct
Chips
Micron launches 192 GB socamm2 for low-power AI data centers
3 Oct
Chips
NVIDIA Delays SOCAMM Memory Standard, Targeting Launch with ´Rubin´ AI GPUs
26 Sep
Chips
Weekly news roundup: Intel, Samsung, TSMC shift chip strategy, DDR4 surges, China rises in AI and CIS
18 Sep
Chips
DDR6 memory to debut in 2027 with speeds up to 17,600 MT/s
4 Sep
Chips
Marvell extends CXL ecosystem leadership with Structera interoperability across major memory and CPU platforms
27 Jul
Chips
Micron unveils high-density, radiation-tolerant memory for space applications
27 Jul
Chips
Nvidia taps Micron for large-scale SOCAMM memory rollout in 2025
15 Jun
Chips
Semiconductor business and startup highlights: AI, funding surges, and policy shifts
15 Jun
Chips
Micron integrates high-capacity HBM3E memory into AMD Instinct MI350 Series
15 Jun
Chips
Micron expands U.S. investments in DRAM manufacturing and R&D
14 Jun
Chips
Micron ships HBM4 samples with 36 GB capacity and 2 TB/s bandwidth
6 Jun
Chips
Micron unveils world´s first 1-gamma LPDDR5X memory for smartphones
15 May
Chips
Samsung Bets on Hybrid Bonding for HBM4 to Enhance Performance and Efficiency
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