Renesas debuts Gen 3 MRDIMM chipset for DDR5 servers

Renesas Electronics Corporation (TSE: 6723) announced third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module (MRDIMM) chipset solutions for server memory, with support for DDR5 server-class MRDIMM speeds up to 16,000 mega transfers per second (MT/s). The company positioned the components for systems needing higher memory bandwidth across AI data centers, cloud infrastructure and accelerated compute workloads.

Renesas plans to show memory interface components for Gen 3 MRDIMMs at FMS 2026 (Future of Memory and Storage Conference) in Santa Clara, California, August 4-6, 2026, at Booth #807. The lineup includes a third-generation Multiplexed Registering Clock Driver (MRCD, RRG5013) and Multiplexed Data Buffer (MDB, RRG5103) designed to support next-generation MRDIMM performance.